Samsung Launches New Multi-Chip Package for 5G Smartphone

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Samsung Electronics on Tuesday announced its new multi-chip package technology. This is a memory product for a 5G smartphone. With the help of this new technology, the Samsung smartphone will be able to establish itself better in the fast growing market.

Samsung Electronics had been working on its new technology for a long time, which is specifically for 5G smartphones. Samsung Electronics on Tuesday announced its new multi-chip package technology. This is a memory product for a 5G smartphone. With the help of this new technology, the company wants to better handle the fast growing market of smartphones. The company said that the uMCP Equipped device will be launched in the global market this month.

Samsung Multi-Chip Package for 5G

Samsung is the world’s largest memory chip maker. The company has made a new memory chipset, whose mass production has also started. It will be known as Low Power Double Data Rate 5 (LPDDR5) Universal Flash Storage (UFS). It will offer high-performance DRAM and NAND flash memory chipsets in a single compact package. The new MCP technology will get its LPDDR5 mobile DRAM, which will provide a powerful speed of 25 Gbps, which will be 1.5 times faster than the previous generation LPDDRX. Whereas the UFS 3.1 interface-based NAND flash will get nearly double the speed of 3GB/s compared to the earlier UFS 2.2.

Samsung’s Exynos RF 5500 supports legacy networks and 5G-NR sub-6GHz networks in a single chip, offering added flexibility in smartphone designs, especially for today’s premium mobile devices. RF transceivers are key components that allow smartphones to transmit and receive data over the cellular network.

When transmitting voice or data from a smartphone to a carrier, the RF up-converts the modem’s baseband signal to high GHz-range cellular frequencies so that data can be sent swiftly over the connected network. Vice versa, when receiving, the signal is down-converted by the RF to baseband frequencies for it to be processed by the modem. The Exynos RF 5500 has 14 receiver paths for download and supports 4×4 MIMO (Multiple-Input, Multiple-Output) and higher-order 256 QAM (Quadrature Amplitude Modulation) scheme to maximize the data transfer rate over the 5G network.

Samsung Multi-Chip Package for 5G

Having said this, according to the different storage needs, many memory storage options will be given to the customers. With the help of DRAM, storage from 6GB to 12GB and NAND Flash from 128GB to 512GB will be made available. The company, one of the world’s top smartphone vendors, has said that the LPDDR5 uMCP chipset will help users get high-quality 5G content service in stable conditions. For this, it will not be necessary to buy a premium device.

Samsung Multi-Chip Package for 5G

Amazing speeds can be achieved even in low-tier devices. According to the Yonhap news agency report, the new uMCP chip only takes up a space of 11.5mm to 13mm. In such a situation, it will be of great help to increase the space in the smartphone. In such a situation, handset manufacturers will have many options for designing mobile devices.

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Lingraj Sahu
Lingraj is one of the youngest members of PhoneTalk, and a recent tech geek convert. When he's not churning out articles, you’ll find him watching sports, exploring new places, and listening to music.